Polar Instruments Si9000e is the industry-standard software for calculating the impedance of PCB transmission lines. It provides accurate models for various transmission line structures including microstrip, stripline, coplanar waveguide, and differential pairs. The software is essential for designing high-speed digital circuits, RF/microwave systems, and any application requiring controlled impedance on PCBs. Si9000e incorporates field solver accuracy with practical engineering interfaces
Si9000e serves PCB and high-speed design professionals:
PCB Design Engineers calculating controlled impedance for high-speed designs
Signal Integrity Engineers analyzing transmission line performance
RF/Microwave Designers designing impedance-matched circuits
EDA Librarians creating accurate footprint and stackup definitions
PCB Fabrication Engineers verifying manufacturing tolerances
Academic Researchers teaching transmission line theory and PCB design

50+ Transmission Line Types: Microstrip, stripline, coplanar, edge-coupled, embedded
Differential Pair Calculations: Even/odd mode impedance, coupled line analysis
Advanced Structures: Offset stripline, broadside coupled, asymmetric stripline
Material Models: Frequency-dependent dielectric constant and loss tangent
2D Field Solver: Boundary element method (BEM) for accurate impedance calculation
Frequency Domain Analysis: Up to 100 GHz with dispersion modeling
Manufacturing Tolerances: Analysis of impedance variation due to fab tolerances
Temperature Effects: Temperature-dependent material property modeling
EDA Integration: Links with Cadence Allegro, Mentor Xpedition, Altium Designer
Stackup Design: Complete PCB stackup design and analysis
Design Rule Checking: Impedance rule verification
Report Generation: Automated stackup and impedance reports
AI-Powered Impedance Optimization: Machine learning suggests optimal trace geometries for target impedance
3D Transmission Line Analysis: Preliminary 3D field solving for complex structures
Quantum Computing Interfaces: Experimental integration for ultra-complex transmission line arrays
Metamaterial Substrates: Modeling of engineered dielectric materials
Smart FabLink: Real-time connection to PCB fabricators’ capabilities databases
Advanced Tolerance Analysis: Statistical analysis of impedance variations
Additive PCB Support: Modeling for inkjet-printed and 3D-printed PCBs
Flex/Rigid-Flex Enhancements: Improved models for flexible circuits
GPU-Accelerated Solving: NVIDIA CUDA support for faster calculations (5-10x speedup)
Cloud Collaboration: Shared stackup databases and team collaboration features
Automated Stackup Import: Direct import from major EDA tools
Real-time SI Simulation: Basic signal integrity simulation integration
Modernized UI: Updated interface with dark mode and customizable layouts
Contextual Help: AI-assisted guidance for complex scenarios
Batch Processing: Automated calculation of multiple structures
Enhanced Visualization: 3D field plots and animated parameter sweeps
Minimum Requirements:
OS: Windows 10 Pro 64-bit (21H2) or Windows 11 Pro
CPU: Intel Core i5-10400 or AMD Ryzen 5 3600 (6 cores)
RAM: 16 GB (32 GB recommended for large designs)
GPU: Integrated graphics sufficient (discrete recommended for 3D views)
Storage: 10 GB free SSD space
Display: 1920×1080 minimum
Recommended Configuration:
OS: Windows 11 Pro
CPU: Intel Core i7-13700K or AMD Ryzen 7 7700X (16 threads)
RAM: 64 GB DDR5 (for complex multi-board systems)
GPU: NVIDIA RTX 4060 or equivalent (for GPU acceleration)
Storage: 500 GB NVMe SSD
Network: Internet connection for cloud features
Price: 325 $
Price Currency: $
Operating System: Windows
Application Category: Electronics
Reviews
There are no reviews yet.